Stencils

Solder paste and glue stencils for surface-mounted circuit boards

HP-Etch offer world-class competence and equipment for manufacturing of stencils.  This means that we can meet extremely high standards for precision solder paste application. We offer complete customer solutions, including mask stretching and frame.  Each stencil is designed to your specifications.  Our background ensures that we are well equipped to meet the market's demands for high product quality and short delivery times.  We have developed a system that allows extremely short delivery times of solder paste stencils. Above is also applicable for glue stencils. Do you need an orderform? Please e-mail stencil@hpetch.se and write "orderform" as subject. Please contact us for more information

Solder paste stencils are used in the electronics and computer industry for surface-mounted circuit boards. Stepetched stencil for finepitch components.

Technical data

Rawmaterial:	Stainless steel type AISI 302
Size:	Up to 595mm x 750mm
Thickness:	0.102, 0.120, 0.127, 0.152, 0.178, 0.203, 0.254, 0.305 och 0.356
Thickness tolerance:	+/- 0.003 mm
Aperture size:	+/- 0.015 mm
Location against CADdata	X and Y within 300 mm +/- 0.01
Stepetched stencils	Step-up / step-down  (level-etched)
Delivery time: 24 hours to 3 days
Nickel/Teflon	Surface treatment  (patented)